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IEEE
2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020; ; ;10.1109/ECTC32862.2020.00315
Direct wafer bonding
initial bonding energy
plasma-modified dielectric surface
SiCN-SiCN bonding
SiO-SiO bonding
Characteristics of Plasma-activated Dielectric Film Surfaces for Direct Wafer Bonding
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