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International Publications 2010

1. Investigation of the plasma uniformity in an internal linear antenna-type inductively coupled plasma source by applying dual frequency
G.H. Gweon, J.H. Lim, K.N. Kim, S.P. Hong, T.H. Min and G,Y.Yeom
Vacuum 84 (2010) January 823-827
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International Publications 2009
1. Line-type inductively coupled plasma source with ferromagnetic module
J.H. Lim, K.N. Kim, G.H. Gweon and G.Y. Yeom
J. Phys. D: Appl. Phys. 42 (2009) January 015204(5pp)
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2. Neutralization efficiency estimation in a neutral beam source based on inductively coupled plasma
O.V.Vozniy and G.Y. Yeom
JOURNAL OF APPLIED PHYSICS 105 (2009) January 013308(7pp)
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3. Atomic layer etching of ultra-thin HfO2 film for gate oxide in MOSFET devices
J.B. Park, W.S. Lim, B.J. Park, I.H. Park, Y.W. Kim and G.Y. Yeom
J. Phys. D: Appl. Phys. 42 (2009) February 055202 (5pp)
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4. Etch Characteristics of TiO2 Etched by Using an Atomic Layer Etching technique with BCl3 Gas and an Ar Neutral Beam
J.B. Park, W.S. Lim, S.D. Park, B.J. Park and G.Y. Yeom
Journal of the Korean Physical Society, 54 3(2009) March 976-980
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5. Characteristics of SiOx Thin Films Deposited by Using Direct-Type Pin-to-Plate Dielectric Barrier Discharge with PDMS/He/O2 Gases at Low Temperature
J.H. Lee, Y.S. Kim, S.J. Kyung, J.T. Lim and G.Y. Yeom
Journal of the Korean Physical Society, 54 3(2009) March 981-985
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6. Electronic structures of Ba-on-Alq3 interfaces and device characteristics of organic light-emitting diodes based on these interfaces
J.T Lim, G..Y. Yeom, K.W. Lhmand T.H. Kang
JOURNAL OF APPLIED PHYSICS 105, (2009) April 083705
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7. Atmospheric pressure PECVD of SiO2 thin film at a low temperature using HMDS/O2/He/Ar
Y.S. Kim, J.H. Lee, J.T. Lim J.B. Park and G.Y. Yeom
Thin Solid Films 517 (2009) May 4065-4069
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8. Residual stress on nanocrystalline silicon thin films deposited under energetic ion bombardment by using internal ICP-CVD
H.C. Lee, S.P. Hong, S.K. Kang and G.Y. Yeom
Thin Solid Films 517 (2009) May 4100-4103
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9. Characteristics of SiOx Thin Film Deposited by Atmospheric Pressure Plasma-Enhanced Chemical Vapor Deposition Using PDMS/O2/He
J.H. Lee, Y.S. Kim, J.S. Oh, S.J. Kyung, J.T. Lim, and G.Y. Yeom
Journal of The Electrochemical Society, 156 7 (2009) May D248-D252
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10. High-energy negative ion beam obtained from pulsed inductively coupled plasma for charge-free etching process
O. V. Vozniy and G. Y. Yeom
APPLIED PHYSICS LETTERS, 94 (2009) June 231502
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11. Improvement of surface roughness in silicon-on-insulator wafer fabrication using a neutral beam etching
T.H. Min, B.J. Park, S.K. Kang, G.H. Gweon, Y.Y. Kim and G.Y. Yeom
J. Phys. D: Appl. Phys. 42 (2009) July 155204 (6pp)
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12. Bulk and Interface effects on voltage linearity of ZrO2.SiO2 multilayered metal-insulator-metal capacitors for analog mixed-signal applications
S.D. Park,C. Park, D.C. Gilmer, H.K. Park, C.Y. Kang, K.Y. Lim, C.Burham, J. Barnett, P.D. Kirsch, H.H. Tseng,
R. Jammy and G.Y. Yeom
APPLIED PHYSICS LETTERS 95 (2009) July 022905
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13. Study of Internal Linear Inductively Coupled Plasma Source for Ultra Large-Scale Flat Panel Display Processing
J.H. Lim, K.N. Kim, G.H. Gweon, J.B. Park and G.Y. Yeom
Plsma Chemistry and Plasma Processing, 29 4 (2009) July 251-259
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14. Effect of Antenna Diameter on the Characteristics of Internal-Type Linear Inductively Coupled Plasma
J.H. Lim, K.N. Kim, G.H. Gweon, S.P. Hong and G.Y. Yeom
Japanese Journal of Applied Physics 48 (2009) September 096002
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15. Plasma texturing of multicrystalline silicon for solar cell using remote-type pin-to-plate dielectric barrier discharge
J.B. Park, J.S. Oh, E.l. Gil, S.J. Kyoung ,J.S. Kim and G.Y. Yeom
J. Phys. D: Appl. Phys. 42 (2009) September 215201 (6pp)
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16. Effect of Multi-Polar Magnetic Field on the Properties of Nanocrystalline Silicon Thin Film Deposited by Internal-Type Inductively Coupled Plasma
H.B. Kim, H.C. Lee, K.N. Kim, S.K. Kang and G.Y. Yeom
Journal of Nanoscience and Nanotechnology 9 (2009) October 7440-7445
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17. Low Damage Atomic Layer Etching of ZrO2 by Using BCl3 Gas and Ar Neutral Beam
W.S. Lim, J.B. Park, J.Y. Park, B.J. Park, and G.Y. Yeom
Journal of Nanoscience and Nanotechnology 9 (2009) October 7379-7382
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18. Device Characteristics of Organic Light-Emitting Diodes Based on Electronic Structure of the Ba-Doped Alq3 Layer
J.T. Lim, K.N. Kim and G.Y. Yeom
Journal of Nanoscience and Nanotechnology 9 (2009) October7485-7490
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19. Plasma Characteristics of Large Area Inductively Coupled Plasma System Using Ferrite-Module-Enhanced U-Type Antenna
K.N. Kim, J.H. Lim and G.Y. Yeom
Japanese Journal of Applied Physics 48 (2009) November 116006
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20. Light-Emitting Characteristics of Organic Light-Emitting Diodes with Ba/Al Cathode and Effect of Ba Thickness by Measuring their Built-in Potential
J.T. Lim and G.Y. Yeom
Japanese Journal of Applied Physics 48 (2009) December 122102
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International Publications 2008

1. Low angle forward reflected neutral beam source and its applications
B.J. Park, S.W. Kim, S.K. Kang, K.S. Min, S.D. Park, S.J. Kyung, H.C. Lee, J.W. Bae, J.T. Lim, D.H. Lee, and G.Y Yeom
J. Phys. D: Appl. Phys, 41 (2008) 024005(13pp)
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2. Light-Emitting Characteristics of Top-Emitting Organic Light-Emitting Diodes Based on the Interfacial Electronic Feature of Cs-on-Alq3
J.T. Lim, J.H. Lee, Y.S. Kim, and G.Y. Yeom
Journal of the Korean Physical Society, 52 2 (2008) 476-480
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3. Characteristics of a Ferromagnetic-Enhanced Inductively-Coupled Plasma by an Internal Linear Antenna
J.H. Lim, K.N. Kim, J.K. Park, and G.Y. Yeom
Journal of the Korean Physical Society, 52 2 (2008) 313-317
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4.Comparison of the Electrical Characteristics of Serpentine-Type and Double-Comb-Type Antennas for Large-Area Plasma Generation
J.K. Park, K.N. Kim, J. H. Lim, and G.Y. Yeom
Journal of the Korean Physical Society, 52 2 (2008) 308-312
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5. Plasma Characteristics and Antenna Electrical Characteristics of an Internal Linear Inductively Coupled Plasma Source with a Multi-Polar Magnetic Field
K.N. Kim, J.H. Lim, J.K. Park, G.Y. Yeom, S.H. Lee, and J.K. Lee
Plasma Chem Plasma Process, 28 (2008) 147-158
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6. White top-emitting organic light-emitting diodes using one-emissive layer of the DCJTB doped DPVBi layer
M.S. Kim, C.H. Jeong, J.T. Lim, and G.Y. Yeom
Thin Solid Films 516 (2008) 3590-3594
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7. Uniformity of internal linear-type inductively coupled plasma source for flat panel display processing
J.H. Lim, K. N. Kim, J. K. Park, J. T. Lim, and G. Y. Yeom
Applied Physics Letters 92, (2008) 051504
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8. Effect of N2O plasma treatment on the performance of ZnO TFTs
K. Remashan, D.K. Hwang, S.D. Park, J.W. Bae, G.Y. Yeom, S.J. Park, and J.H. Jang
Electrochemical and Solid-State Letters, 11 (3) (2008) H55-H59
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9. Characteristics of SiO2-like thin film deposited by atmospheric-pressure PECVD using HMDS/O2/Ar
J.H. Lee, Thuy. T.T. Pham, Y.S. Kim, J.T. Lim, S.J. Kyung, and G.Y. Yeom
Journal of The Electrochemical Society, 155 (3) (2008) D163-D166
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10. Precise depth control and low-damage atomic-layer etching of HfO2 using BCl3 and Ar neutral beam
S.D. Park, W.S. Lim, B.J. Park, H.C. Lee, J.W. Bae, and G.Y. Yeom
Electrochemical and Solid-State Letters, 11 (4) (2008) H71-H73
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11. Neutralized fluorine radical detection using single-walled carbon nanotube network
S.H. Jung, S.H. Hong, B.J. Park, J.B Choi, Y.J. Kim, G.Y. Yeom, and S.H. Baik
Carbon 46 (2008) 24-29
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12. Effect of capacitive to inductive coupling transition in multiple linear U-type antenna on silicon thin film deposition from pure SiH4 discharges
H.B. Kim, H.C.Lee, K.N. Kim and G.Y. Yeom
J. Vac. Sci. Technol, A26 4 (2008) 842-846
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13. Top-emitting organic light-emitting diodes with Ba/Ag/indium tin oxide cathode and built-in potential analyses in these devices
J.T. Lim, J.H. Lee, G.Y. Yeom, E.H. Lee and T.W. Kim
J. Vac. Sci. Technol, A26 (2008) 961-965
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14. Improvement of electron field emission from carbon nanotubes by Ar neutral beam treatment
S.J. Kyung, J.B. Park., B.J. Park, J.H. Lee and G.Y. Yeom
Carbon, 46 (2008) 1316-1321
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15. Plasma-Enhanced Chemical Vapor Deposition of SiO2 Thin Films at Atmospheric Pressure by Using HMDS/Ar/O2
Y.S. Kim, J H. Lee, Thuy.T.T. Pham, J.T. Lim and G.Y. Yeom
Journal of the Korean Physical Society, 53 2 (2008) 892-896
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16. Laser Annealing on Ti Electrode: Impact on TiOHfO2OSiO2 n-Type MOSFET
S.H. Heo, R. Dong, Musarrat Hasan, H.S. Hwang, S.D. Park and G. Y. Yeom
Electrochemical and Solid-State Letters, 11 10 (2008) 276-279
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17. Effect of the surface texturing shapes fabricated using dry etching on the extraction efficiency of vertical light-emitting diodes
H.C. Lee, J.B. Park, J.W. Bae, Pham Thi Thu Thuy, M.C. Yoo and G.Y. Yeom
Solid-State Electronics, 52 (2008) 1193-1196
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18. A Two-Step-Recess Process Based on Atomic-Layer Etching for High-Performance 0.52Al0.48As/In0.53Ga0.47As p-HEMTs
T.W. Kim, Associate Member, IEEE, D.H. Kim, S.D. Park, S.H.Shin, S.J. Jo, H.J. Song, Associate Member, IEEE, Y.M. Park, J.O. Bae, Y.W. Kim, G.Y. Yeom, J.H. Jang J.I. Song, senior Member, IEEE
IEEE TRANSACTIONS ON ELECTRON DEVICES, 55 7 (2008) 1577-1584
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19. X-ray photoelectron spectroscopic study of Ge2Sb2Te5 etched by fluorocarbon inductively coupled plasmas
S.K. Kang, J.S. Oh, B.J. Park, S.W. Kim, J.T. Lim, G.Y. Yeom, C.J. Kang and G. J. Min
APPLIED PHYSICS LETTERS, 93 (2008) 043126
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20. Scalable internal linear double comb-type inductively coupled plasma source for large area flat panel display processing
K.N. Kim, J.H. Lim, J.K. Park and G.Y. Yeom
Surface & Coatings Technology 202 (2008) 5242-5245
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21. Properties of SixNy thin film deposited by plasma enhanced chemical vapor deposition at low temperature using SiH4/NH3/Ar as diffusion barrier film
Thuy T.T. Pham, J.H. Lee, Y.S. Kim and G.Y. Yeom
Surface & Coatings Technology, 202 (2008) 5617-5620
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22. Atomic layer etching of (100)/(111) GaAs with chlorine and low angle forward reflected Ne neutral beam
W.S. Lim, S.D. Park, B.J. Park and G.Y. Yeom
Surface & Coatings Technology, 202 (2008) 5701-5704
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23. Top-emitting organic light-emitting diodes based on semitransparent conducting cathode of Ba/Al/ITO
J.T. Lim, J.H. Lee, J.K. Park, B.J. Park and G.Y. Yeom
Surface & Coatings Technology 202 (2008) 5646-5649
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24. Characteristics of Plasma Using a Ferromagnetic Enhanced Inductively Coupled Plasma Source
K.N. Kim, J.H. Lim, J.K. Park, J.T. Lim, and G.Y. Yeom
Japanese Journal of Applied Physics, 47 9 (2008) 7339-7342
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25. Effect of antenna capacitance on the plasma characteristics of an internal linear inductively coupled plasma system
J.H. Lim, K.N. Kim, J.K. Park, and G.Y. Yeom
PHYSICS OF PLASMAS, 15 (2008) 083501
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26. Effect of initial crystallized silicon layer on the properties of microcrystalline silicon grown by internal nductively coupled plasma-type plasma enhanced chemical vapor deposition
H.C. Lee, H.B. Kim, G.Y. Yeom, I.H. Park and Y.W. Kim
Surface & Coatings Technology, 203 (2008) 799-803
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27. Selective Etching of HfO2 by Using Inductively-Coupled Ar/C4F8 Plasmas and the Removal of Etch Residue on Si by Using an O2 Plasma Treatment
K.S. Min, B.J. Park, S.W. Kim, S.K. Kang, G.Y. Yeom, S.H. Heo, H.S. Hwang and C.Y. Kang
Journal of the Korean Physical Society, 53 3 September (2008) 1675-1679
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28. Plasma etching of SiO2 using remote-type pin-to-plate dielectric barrier discharge
J.B. Park, S.J. Kyung, and G.Y.Yeom
JOURNAL OF APPLIED PHYSICS, 104 (2008) 083302
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29. Characteristics of Al2O3 gate dielectrics partially fluorinated by a low energy fluorine beam
S.W. Kim, B.J. Park, S.K. Kang, B.H. Kong, H.K. Cho, G,Y, Yeom, S.H Heo and H.S Hwang
APPLIED PHYSICS LETTERS, 93 (2008) 191506
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30. Device Performance of the Top-Emitting Organic Light-Emitting Diodes Using the Ba/Au/Indium Tin Oxide Cathode System with Long Skin Depth
J.T. Lim, C.H. Jeong and G.Y. Yeom
Japanese Journal of Applied Physics, 47 10 (2008) 8039-8042
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International Publications 2007

1. Doped-Fluorine on electrical and optical properties of tin oxide films grown by ozone-assisted thermal CVD
J.W. Bae, S.W. Lee, and G.Y. Yeom
Journal of The Electrochemical Society, 154(1) (2007) D34-D37
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2. Surface analysis of atomic-layer-etched silicon by chlorine
C.K. Oh, S.D. Park, H.C. Lee, J.W. Bae, and G.Y. Yeom
Electrochemical and Solid-State Letters, 10 (3) (2007) H94-H97
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3. SiOxNy thin film deposited by plasma enhanced chemical vapor deposition at low temperature using HMDS-O2-NH3-Ar gas mixtures
J.H. Lee, C.H. Jeong, J.T. Lim, V.A. Zavaleyev, S.J. Kyung, and G.Y. Yeom
Surface & CoatingsTechnology, 201 (2007) 4957-4960
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4. Top-emitting organic light-emitting diode using transparent conducting indium oxide layer fabricated by a two-step ion beam-assisted deposition
J.T. Lim, C.H. Jeong, A. Vozny, J.H. Lee, M.S. Kim, and G.Y. Yeom
Surface & CoatingsTechnology, 201 (2007) 5358-5362
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5. Effects of inductively coupled plasma treatment using O2, CF4, and CH4 on the characteristics of organic light emitting diodes
C.H. Jeong, J.H. Lee, J.T. Lim, M.S. Kim, and G.Y. Yeom
Surface & CoatingsTechnology, 201 (2007) 5012-5016
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6. The effect of atmospheric pressure plasma treatment on the field emission characteristics of screen printed carbon nanotubes
S.J. Kyung, J.B. Park, Maksym Voronko, J.H. Lee and G.Y. Yeom
Carbon, 45 (2007) 649-654
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7. Growth of carbon nanotubes by atmospheric pressure plasma enhanced chemical vapor deposition using NiCr catalyst
S.J. Kyung, Voronko M., Y.H. Lee, C.W. Kim, J.H. Lee, and G.Y. Yeom
Surface and Coatings Technology, 201 (2007) 5378-5382
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8. Anisotropic etching of InP and InGaAs by using an inductively coupled plasma in Cl2/N2 and Cl2/Ar mixtures at low bias power
J.W. Bae, C.H. Jeong, J.T. Lim, H.C. Lee, G.Y. Yeom, and I. Adesida
Journal of the Korean Physical Society, 50(4) (2007) 1130-1135
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9. Effect of neutral beam etching of p-GaN on the GaN device characteristics
B.J. Park, K.S. Min, H.C. Lee, J.W. Bae, D.W. Kim, and G.Y. Yeom
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 25(2) (2007) 295-298
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10. Effect of fluorine ion/neutral-beam irradiation on ohmic contact formation to n-type GaN
H.C. Lee, J.W. Bae, B.J. Park, J.H. Jang, and G.Y. Yeom
Electrochemical and Solid-State Letters, 10(6) (2007) 161-164
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11. Plasma and antenna characteristics of a linearly extended inductively coupled plasma system using multi-polar magnetic field
K.N. Kim, J.H. Lim, and G.Y. Yeom
Thin Solid Films, 515(12) (2007) 5193-5196
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12. Effect of additive gases on the selective etching of ZrOx film using inductively coupled BCl3-based plasmas
S.D. Park, J.H. Lim, and G.Y. Yeom
Thin Solid Films, 515(12) (2007) 5045-5048
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13. Energy shift during ion extraction from an ICP source
O.V. Vozniy , B.J. Park, K.S. Min, and G.Y. Yeom
Journal of the Korean Physical Society, 50(5) (2007) 1271-1275
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14. The effect of Ar neutral beam treatment of screen-printed carbon nanotubes for enhanced field emission
S.J. Kyung, J.B. Park, B.J. Park, K.S. Min, J.H. Lee, G.Y. Yeom, Y.S. Shin, and C.Y. Park
Journal of Applied Physics, 101(8) (2007) 83305
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15. Two-dimensional fluid simulation of large-area plasma source with parallel resonance antenna
S.M. Choi, S.H. Lee, J.G. Lee, K.N. Kim, and G.Y. Yeom
Computer Physics Communicationsm 177 (1-2) (2007) 126
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16. Synthesis,structural characterization and photoluminescence properties of SiOx nanowires prepared using a palladium catalyst
H.W. Kim, S.H. Shim, J.W. Lee, C.M. Lee, G.Y. Yeom, N.E. Lee, J.B.Yoo, Y.C. Joo, H.J. Kim, and E.J. Yoon
Journal of the Korean Physical Society, 50 6 (2007) 1799-1802
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17. High efficiency white organic light-emitting diodes from one emissive layer
C.H. Jeong, J .T Lim., M.S. Kim, J.H. Lee, J.W. Bae, and G.Y. Yeom
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
, 46 2 (2007) 806-809
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18. Top-emitting organic light-emitting diodes using Cs/Al/Ag cathodes
J.T Lim., C.H. Jeong, M.S. Kim, J.H. Lee, J.W. Bae, and G.Y. Yeom
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
, 46 7A (2007) 4296-4299
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19. High-luminance top-emitting organic light-emitting diodes using CsAlAu as the semitransparent multimetal cathode
J.T. Lim, C.H. Jeong, J.H. Lee, G.Y. Yeom, E.C. Shin, E.H. Lee, and T.W Kim.
Journal of the Electrochemical Society, 154 10 (2007) 302-305
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20. Transparent top-emitting organic light-emitting diodes using a Cs/AI/Ag/ITO semi-transparent cathode
J.T. Lim, C.H. Jeong, M.S. Kim, J.H. Lee, J.W. Bae, and G.Y. Yeom
Journal of the Korean Physical Society, 51 3 (2007) 1147-1151
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21. Thermally stable Ti/Al/W/Au multilayer ohmic contacts on n-type GaN
H.C. Lee, J.W. Bae, and G.Y. Yeom
Journal of the Korean Physical Society, 51 3 (2007) 1046-1049
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22. Study on the low-angle surface scattering of the low-energy ions
K.S. Min, B.J. Park, J.B. Park, S.K. Kang, G.Y. Yeom, and D.H. Lee
Journal of the Korean Physical Society, 51 3 (2007) 967-971
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23. Blue organic light-emitting diodes fabricated by using an enhanced hole-blocking property
J.T. Lim, C.H. Jeong, J.H. Lee, M.S. ,Kim J.W. Bae, and G.Y. Yeom
Journal of the Korean Physical Society, 51 3 (2007) 1019-1022
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24. Study of selective amorphous silicon etching to silicon nitride using a pin-to-plate dielectric barrier discharge in atmospheric pressure
S.J. Kyung, J.B. Park, J.H. Lee, J.T. Lim, and G.Y. Yeom
Applied Physics Letters, 91 9 (2007) 91504
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25. Fabrication of InAs composite channel high electron mobility transistors by utilizing Ne-based atomic layer etching
T.W. Kim, J.I. Song, J.H. Jang, D.H. Kim, S.D. Park, J.W. Bae, and G.Y. Yeom
Applied Physics Letters, 91 10 (2007) 102110
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26. Loss current minimization during ion extraction from an inductively coupled plasma
Oleksiy Vozniy, Kostyantyn Polozhiy, and G.Y. Yeom
Journal of Applied Physics, 102 (2007) 083306
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27. Atmospheric pressure remote plasma ashing of photoresist using pin-to-plate dielectric barrier discharge
J.B. Park, S.J. Kyung, and G.Y. Yeom
Japanese Journal of Applied Physics 46 38 (2007) L942-L944
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28. Highly selective and low damage atomic layer etching of InP/InAlAs heterostructures for high electron mobility transistor fabrication
S.D. Park, C.K. Oh, W.S. Lim, H.C. Lee, J.W. Bae, G.Y. Yeom, T.W. Kim, J.I. Song, and J.H. Jang
Applied Physics Letters, 91 1 (2007) 13110
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29. Four-wavelength white organic light-emitting diodes using 4,4'-bis-[carbazoyl-(9)]-stilbene as a deep blue emissive layer
C.H. Jeong, J.T. Lim, M.S. Kim, J.H. Lee, J.W. Bae, and G.Y. Yeom
Organic Electronics: physics, materials, applications, 8 6 (2007) 683-689
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30. Effect of ion bombardment on the chemical and the mechanical properties of Silicon-Nitride thin films deposited by using PECVD with SiH4/NH3/Ar gases at low temperature
Thuy T.T. Pham, J.H. Lee, Y.S. Kim, and G.Y. Yeom
Journal of the Korean Physical Society, 51 6 (2007) 1934-1939
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31. High-speed etching of amorphous silicon using pin-to-plate dielectric barrier discharge
S.J. Kyung, J.B. Park, Y.H. Lee, J.H. Lee, and G.Y. Yeom
Surface & Coatings Technology 202 (2007) 1204-1207
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32. Characteritics of inductively coupled plasma using internal double comb-type antenna for flat panel display processing
J.H. Lim, K.N. Kim, J.K. Park, J.H. Park, and G.Y. Yeom
Japanese Journal of Applied Physics, 46 48 (2007), L1216-L1218
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33. Effect of a two-step recess process using atomic layer etching on the performance of In0.52Al0.48As/In0.53Ga0.47As p-HEMTs
T.W. Kim, D.H. Kim, S.D. Park, G.Y. Yeom, B.O. Lim, J.K. Rhee, J.H. Jang, and J.I. Song
IEEE ELECTRON DEVICE LETTERS, 28 12 (2007) 1086-1088
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34. Characteristics of inductively coupled plasma with internal linear antenna using multi-polar magnetic field for FPD processing
J.H. Lim, K.N. Kim, and G.Y. Yeom
Solid State Phenomena, 124-126 (2007) 271-274
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35. Formation of high flux parallel neutral beam using a three grid system of ion beam during low angle forward reflection of ions
B.J. Park, K.S. Min, S.D. Park, J.W. Bae, Oleksiy Vozniy and G.Y. Yeom
Solid State Phenomena, 124-126 (2007) 275-278

International Publications 2006
1. Characteristics of a large area plasma source using internal multiple U-type antenna
K.N. Kim, and G.Y. Yeom
Journal of the Korean Physical Society, 48 2 (2006) 256 - 259
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2. Characteristics of SiOxNy films deposited by PECVD at low-temperature using BTBAS-NH3-O2
J.H. Lee, C.H. Jeong, J.T. Lim, V.A. Zavalyev, K.S. Min, S.J. Kyong, and G.Y. Yeom
Journal of the Korean Physical Society, 48 1 (2006) 89 - 92
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3. White Organic light-emitting diodes using bis aluminum(III) as a new hole-blocking layer
J.T. Lim, C.H. Jeong, J.H. Lee, J.H. Lim, and G.Y. Yeom
Japanese Journal of Applied Physics, 45 3A (2006) 1826-1828
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4. Selective plasma etching of ZrOx to Si using inductively coupled BCl3/C4F8 plasmas
S.D. Park, J.H. Lim, C.K. Oh, H.C. Lee, and G.Y. Yeom
Applied Physics Letters, 88 (2006) 094107-1 ~ 094107-3
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5. Plasma and electrical characteristics of a novel internal linear inductively coupled plasmasource for flat panel display applications
K.N. Kim, and G.Y. Yeom
Journal of the Korean Physical Society, 48 3 (2006) 422 - 426
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6. Effective plasma confinement by applying multipolar magnetic fields in an internal linear inductively coupled plasma system
K.N. Kim, M.S. Kim, and G.Y. Yeom
Applied Physics Letters, 88 (2006) 161503-1 ~161503-3
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7. Study on the O2 plasma treatment of indium tin oxide for organic light emitting diodes using inductively coupled plasma
C.H. Jeong, J.H. Lee, J.H. Lim, J.T. Lim, and G.Y. Yeom
Japanese Journal of Applied Physics, 45 4A (2006) 2788-2791
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8. Field emission properties of carbon nanotubes synthesized by capillary type atmospheric pressure plasma enhanced chemical vapor deposition at low temperature
S.J. Kyung, Y.H. Lee, C.W. Kim, J.H. Lee, and G.Y. Yeom
Carbon, 44 (2006) 1530-1534
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9. Characteristic of carbon nanotubes synthesized by pin-to-plate type atmospheric pressure plasma enhanced chemical vapor deposition at low temperature
Y.H. Lee, S.J. Kyung, C.W. Kim, and G.Y. Yeom
Carbon, 44 (2006) 799-823
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10. Deposition of carbon nanotubes by capillary-type atmospheric pressure PECVD
S.J. Kyung, Y.H. Lee, C.W. Kim, J.H. Lee, and G.Y. Yeom
Thin Solid Films(APCPST), 506-507 (2006) 268-273
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11. Low Impedance Antenna arrangement of Internal Linear ICP Source for Large Area FPD Processing
S.J. Jung, K.N. Kim, and G.Y. Yeom
Thin Solid Films(APCPST), 506-507 (2006) 460-463
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12. Synthesis and characteristics of bis(2,4-Dimethyl-8-Quinolinolato)(Triphenylsilanolato) Aluminium(III), A Potential Hole-Blocking material for Organic Light-Emitting diodes
J.T. Lim, C.H. Jeong, J.H. Lee, H.K. Jeong, S.Y. Chai, I.M. Lee, and G.Y. Yeom
Journal of the Organometallic Chemistry, 691 (2006) 2701-2707
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13. Atomic layer etching of InP using a low angle forward reflected Ne neutral beam
S.D. Park, C.K. Oh, J.W. Bae, and G.Y. Yeom
T. W. Kim, J. I. Song and J. H. Jang
Applied Physics Letters, 89 (2006) 043109
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14. Photoresist ashing technology using N2/O2 ferrite-core ICP in the dual damascene process
H.W. Kim, J.H. Myung, J.W. Lee, H.S. Kim, K.H. Kim, J.Y. Jang, T.H. Yoon, S.K. Kim, D.K. Choi, C.W. Chung, G.Y. Yeom, J.M. Myoung, and H.J. Kim
Journal of Material Science,41 (2006) 5040-5042
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15. Investigation of the magnetic properties of an RF-Driven inductively coupled argon plasma
O. Vozniy, M. Voronko, B.J. Park, and G.Y. Yeom
Journal of the Korea Physical Society, 49 4 (2006) 1460~1464
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16. Characteristics of SiOxNy films deposited by inductively coupled plasma enhanced chemical vapor deposition using HMDS/NH3/O2/Ar for water vapor diffusion barrier
J.H. Lee, C.H. Jeong, H.B. Kim, J.T. Lim, S.J. Kyung, and G. Y. Yeom
Thin Solid Films, 515 (2006) 917-921
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17. Effect of Indium-Oxide deposited using an oxygen ion-beam-assisted-deposition to top-emitting organic light-emitting diodes
C.H. Jeong, J.T. Lim, J.H. Lee, M.S. Kim, J.W. Bae, and G.Y. Yeom.
Japanese Journal of Applied Physics, 45 10B (2006) 8457-8461
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18. Characteritics of a multilayer SiOx(CH)yNz film deposited by low temperature plasma enhanced Chemical vapor deposition using Hexamethyldisilazane/Ar/N2O
J.H. Lee, C.H. Jeong, J.T. Lim, Viktor A. Zavaleyev, S.J. Kyung, and G.Y. Yeom
Japanese Journal of Applied Physics, 45 10B (2006) 8430-8434
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19. White organic light-emitting diodes from three emitter layers
M.S. Kim, J.T. Lim, C.H. Jeong, J.H. Lee, and G.Y. Yeom
Thin Solid Films, 515 (2006) 891-895
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20. CF4-based neutral-beam Etch Characteristic of Si and SiO2 using a low-angle forward-reflected neutral-beam etching system
D.H. Lee, B.J. Park, K.S. Min, and G.Y. Yeom
Journal of the Korean Physical Society, 49 6 (2006) 2307~2310
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21. Characteristics of large area inductively coupled plasma using a multiple linear Antennas with u-type parallel connection for flat panel display processing
K.N. Kim, K.S. Min, and G.Y. Yeom
Japanese Journal of Applied Physics, 45 1 (2006) 1 8869-8872

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22. Effect of dual frequency on the plasma characteristics in an internal linear inductively coupled plasma source
K.N. Kim, J.H. Lim, and G.Y. Yeom
Applied Physics Letters, 89 (2006) 251501
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23. Improvement of field emission from screen-printed carbon nanotubes by He/(N2, Ar) atmospheric pressure plasma treatment
S.J. Kyung, J.B. Park, J.H. Lee, and G.Y. Yeom
Journal of Applied Physics, 100 (2006) 124303
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24. Nanostructures fabrication on Ta thin film using atomic force microscope lithography
S.Lee, H.Lee, D.H. Lee, B.J. Park, and G.Y. Yeom
Molecular Crystals and Liquid Crystals, 445 (2006) 15[405]-118[408]
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25. OLED deposition characteristics for 4th generation mass-production
C.W. Kim, H.G. Kwo., J.S. Rho, J.S. Yoon, K.B. Bae, C.H. Jeong, and G.Y. Yeom
Digest of Technical Papers - SID International Symposium, 37 (2006) 432-435

26. Large area plasma characteristics using internal linear ICP (Inductively Coupled Plasma) source for the FPD processing
K.N. Kim, J.H. Lim, and G.Y. Yeom
Proceedings of International Meeting on Information Display, 2006 544-547c

International Publications 2005    
1. Fabrication of Si nano-pillar array through Ni nano-dot mask using inductively coupled plasma
M.J. Kim, J.S. Lee, S.K. Kim, G.Y. Yeom, J.B. Yoo, and C.Y. Park
Thin Solid Films, 475 (2005) 41-44
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2. Simulation of ion beam transport in an ion gun for materials processing
S.J. Kim, S.J. Wang, J.K. Lee, Senior Member. IEEE, and G.Y. Yeom
IEEE Transactions on Plasma Science, 33 2 (2005) 538-543
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3. Low-impedance internal linear inductive antenna for large-area flat panel display plasma processing
K.N. Kim, S.J. Jung, Y.J. Lee, G.Y. Yeom, S.H. Lee, and J.K. Lee
Journal Of Applied Physics, 97 (2005) 063302
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4. Characteristics of inductively coupled plasma with multiple u-type internal antenna for flat panel display applications
K.N. Kim, S.J. Jung and G.Y. Yeom
Surface and Coatings Technololgy, 200 (2005) e 784-787
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5. Plasma and impedance characteristics of internal linear antennas for flat panel display applications
K.N. Kim, S.J. Jung and G.Y. Yeom
Thin Solid Films, 491 (2005) 82-85
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6. Novel internal linear inductively coupled plasma source for flat panel display Applications
K.N. Kim, S.J. Jung and G.Y. Yeom
Japanese Journal of Applied physsics, 44 11 (2005) 8133-8137
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7. Etching characteristics of multiple U -type internal linear inductively coupled plasma for flat panel display
S.J. Jung, K.N. Kim and G.Y. Yeom
Surface and Coatings Technology, 200 (2005) 780-783
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8. The effect of N2 flow rate in He/O2/N2 on the chatacteristics of large area pin-to-plate dielectric barrier discharge
Y.H. Lee, S.J. Kyung, C.H. Jeong and G.Y. Yeom
Japanese Journal of Applied physics, 44 2 (2005) 78-81
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9. Properties and applications of a modified dielectric barrier discharge generated at atmospheric pressure
Y.H. Lee and G.Y. Yeom
Japanese Journal of Applied physics, 44 2 (2005) 1076-1080
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10. Characteristics of a pin-to plate dielectric barrier discharge in helium
Y.H. Lee and G.Y. Yeom
Journal of the Korean Physical Society, 47 1 (2005) 74-78
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11. A study of electrical damage to a-Si:H thin film transistor during plasma ashing by a pin-to-plate type atmospheric pressure plasma
Y.H. Lee, S.J. Kyung, J.H. Lim and G.Y. Yeom
Japanese Journal of Applied Physics, 44 48 (2005) 1456-1459
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12. Characteristics of carbon nanotubes deposited by using low-temperature atmospheric-pressure plasma-enhanced chemical vapor deposition
C.W. Kim, Y.H. Lee, S.J. Kyung and G.Y. Yeom
Journal of the Korea Physical Society, 46 4 (2005) 918~921
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13. Effect of pretreatment on the deposition of carbon nanotubes by using atmospheric-pressure plasma enhanced chemical vapor deposition
S.J. Kyung, Y.H. Lee, C.W. Kim, J.H. Lee and G.Y. Yeom
Journal of Korean Physical Society, 47 3 (2005) 463~468
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14. Growth and field emission properties of multiwalled carbon nanotubes synthesized by pin-to-plate type atmospheric pressure plasma enhanced chemical vapor deposition
S.J. Kyung, Maksym Voronko, J.H. Lee and G.Y. Yeom
Journal of the Korean Physical Society, 47 5 (2005) 818~827
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15. Highly efficient vertical laser-liftoff GaN-based light-emitting diodes formed by optimization of the cathode structure
D.W. Kim, H.Y. Lee, M.C. Yoo and G.Y. Yeom
Applied Physics Letters, 86 (2005) 052108
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16. A study of transparent contact to vertical GaN based lighy-emitting diodes
D.W. Kim, H.Y. Lee, Y.J. Sung and G.Y. Yeom
Journal Of Applied Physics, 98 (2005) 053102
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17. Effect of GaN microlens array on efficiency of GaN-based blue-light-emitting diodes
D.W. Kim, H.Y. Lee, N.G. Cho, Y.J. Sung and G.Y. Yeom
Japanese Journal of Applied Physics, 44 1 (2005) 18-20
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18. Characteristics of silicon carbide etching using magnetized inductively coupled plasma
H.Y. Lee, D.W. Kim, Y.J. Sung and G.Y. Yeom
Japanese Journal of Applied Physics, 44 2 (2005) 1445-1449
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19. Fabrication of SiC micro-lens by plasma etching
H.Y. Lee, D.W. Kim, Y.J. Sung and G.Y. Yeom
Thin Solid Films, 475 (2005) 318-322
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20. Effects of axial magnetic field on neutral beam etching by low-angle forward-reflected neutral beam method
D.H. Lee, B.J. Park and G.Y. Yeom
Japanese Journal of Applied Physics, 44 2 (2005) 63-66
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21. Removal of aspect ratio dependent etching by low-angle forward reflected neutral beam etching
D.H Lee, B.J. Park, S.J. Kim, J.K. Lee, K.H. Baek, C.J. Kang and G.Y. Yeom
Journal of Korean Physical Society, 46 4 (2005) 867-871
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22. Precise depth control of silicon etching using chlorine atomic layer etching
S.D. Park, K.S. Min, B.Y. Yoon, D.H. Lee and G.Y. Yeom
Japanese Journal of Applied Physics, 44 1A (2005) 389-393
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23. Atomic layer etching of Si(100) and Si(111) using Cl2 and Ar neutral beam
S.D. Park, D.H. Lee and G.Y. Yeom
Electrochemical and Solid-State Letters,8 (2005) 106-109
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24. Surface roughness variation during Si atomic layer etching by chlorine adsorption followed by an Ar neutral beam irradiation
S.D. Park, C.G. Oh, D.H. Lee and G.Y. Yeom
Electrochemical and Solid-State Letters, 8 11 (2005) 177-179
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25. Atomic Layer Etching of Cl-adsorbed Silicon by using a Low- Angle Forward Reflected Ar Neutral Beam
S.D. Park, D.H. Lee and G.Y. Yeom
Journal of the Korean Physical Society, 47 3 (2005) 469~473
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26. Indium-Oxide thin films deposited by using an oxygen-ion-beam-assisted-deposition technique for top-emitting organic light-emitting diodes
J.T. Lim, N.G. Cho, C.H. Jeong, J.H. Lee, J.H. Lim and G.Y. Yeom
Journal of Korean Physical Society, 47 1 (2005) 142-147
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27. Characteristics of organic light-emitting devices by the surface treatment of indium tin oxide surfaces using atmospheric pressure plasmas
C.H. Jeong, J.H. Lee, Y.H. Lee, N.G. Cho, J.T. Lim, C.H. Moon and G.Y. Yeom
Japanese Journal of Applied physics, 44 1 (2005) 41-44
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28.
Deposition of SiO2 by plasma enhanced chemical vapor deposition as the diffusion barrier to polymer substrates
C.H. Jeong, J.H. Lee, J.T. Lim, N.G. Cho, C.H. Moon and G.Y. Yeom
Japanese Journal of Applied physics, 44 2 (2005) 1022-1026
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29. Properties of SiOxNy thin film deposited by low temperature plasma enhanced chemical vapor deposition using TEOS-NH3-O2-N2 gas mixtures
J.H. Lee, C.H. Jeong. J.T. Lim, N.G. Cho, S.J. Kyung and G.Y. Yeom
Surface and Coating Technology 200 (2005) 680-685
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30. Characteristic of SiO2 films deposited by low temperature PECVD with TEOS/N2/O2
J.H. Lee, C.H. Jeong. J.T. Lim and G.Y. Yeom
Journal of Korean Physical Society, 46 4 (2005) 890-894
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31. Effects of tin concentration and post-annealing on the electrical and the optical properties of In2-xSnxO3 (x=0~0.25) deposited at room temperature
J.W. Bae, H.C. Lee and G.Y. Yeom
Journal of Korean Physical Society, 47 5 (2005) 889-894
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32. Structural and electrical analysis of silicon thin films deposited by transformer-coupled-plasma enhanced chemical-vapor-deposition
H.C. Lee, Y.J. Lee, J.K. Shin, S.I. Baik, Y.W. Kim and G.Y. Yeom
Journal of Korean Physical Society, 47 2 (2005) 277-282
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33. Selective growth of nanometre scale structures with high resolution using thermal energy in AFM lithography
S.W. Lee, H.W. Lee, B.J. Park and G.Y. Yeom
Nanotechnology, 16 (2005) 3137-3141
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International Publications 2004    

1. High rate etching of 6H_SiC in SF6-based magnetically-enhanced inductively coupled plasmas
D.W. Kim , H.Y. Lee , B.J. Park , H.S. Kim , Y.J. Sung , S.H. Chae , Y.W. Ko and G.Y. Yeom
Thin Solid Films, 447-448 (2004) 100-104
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2. Characteristics of neutral beam generated by reflection on a planar-type reflector and its etching properties

D.H. Lee, S.J. Jung, S.D. Park and G.Y. Yeom
Surface and Coatings Technology, 177-178 (2004) 420-425
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3. Effect of additive gases on the selective etching of tungsten films using inductively coupled halogen-based plasmas
S.D. Park , Y.J. Lee , N.G. Cho , S.G. Kim , H.H. Choe , M.P. Hong and G.Y. Yeom
Thin Solid Films, 447-448 (2004) 586-591
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4. Effect of plasma cleanings on the characteristics of MgO layer for plasma display panel

H.K. Hwang, C.H. Jeong, Y.J. Lee, Y.W. Ko and G.Y. Yeom
Surface and Coatings Technology, 177-178 (2004) 705-710
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5. Oxide surface cleaning by an atmospheric pressure plasma
C.H. Yi, C.H. Jeong, Y.H. Lee, Y.W. Ko and G.Y. Yeom
Surface and Coatings Technology, 177-178, (2004) 711-715
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6. Effects of multipolar magnetic fields on the characteristics of plasma and photoresist etching in an internal linear inductively coupled plasma system
K.N. Kim, Y.J. Lee, S.J. Kyong and G.Y. Yeom
Surface and Coatings Technology, 177-178 (2004) 752-757
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7. Reduction of the electrostatic coupling in a large-area internal inductively coupled plasma source using a multicusp magnetic field

Y.J. Lee, K.N. Kim, and G.Y. Yeom, M.A. Lieberman
Applied Physics Letters, 85 10 (2004) 1677-1679
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8. Characteristics of parallel internal-type inductively coupled plasmas for large area flat panel display processing

K.N. Kim, Y.J. Lee, S.J. Jung, and G.Y. Yeom
Japanese journal of applied physics, 43 7A (2004), 4373-4375
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9. Magnetically enhanced inductively coupled plasma etching of 6H-SiC
D.W. Kim, H.Y. Lee, S.J. Kyoung, H.S. Kim, Y.J. Sung, S.H. Chae, and G.Y. Yeom
IEEE Transactions on Plasma Science, 32(3) (2004) 1362~1366
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10. Etching of copper films for thin film transistor liquid crystal display using inductively coupled chlorine-based plasmas
K.H. JANG, W.J. LEE, H.R. KIM and G.Y. YEOM
Japanese Journal of Applied Physics, 43 12 (2004) 8300-8303
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11. Requirements of neutral beam source regarding gas pressure and neutral angle for nanoscale etching
Sung Jin KIM, Hae June LEE1, Geun Young YEOM2 and Jae Koo LEE
Japanese Journal of Applied Physics, 43 10 (2004) 7261-7266
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12. Generation of low-energy neutral beam for Si etching
S.J. Kim, S.J. Wang, J.K. Lee, D.H. Lee and G.Y. Yeom
J. Vac. Sci. Technol, A 22(5) (2004) 1948-1955
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13.Global warming gas emission during plasma cleaning process of silicon nitride using c-C4F8O/O2 chemistry with additive Ar and N2
K.J. Kim, C.H. Oh, N.E. Lee, J.H. Kim, J.W. Bae, G.Y. Yeom and S.S. Yoon
J. Vac. Sci. Technol, B 22 2 (2004) 483-488
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International Publications 2003    
1. Diagnostics of neutral species in the low-angle forward-reflected neutral beam etching system
M.J. Chung, D.H. Lee, and G.Y. Yeom
Surface and Coatings Technology, 171 (2003) 231-236
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2. Sapphire etching with BCl3/HBr/Ar plasma

C.H. Jeong, D.W. Kim, H.Y. Lee, H.S. Kim, Y.J. Sunh, and G.Y. Yeom
Surface and Coatings Technology, 171(2003) 280-284
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3. Influence ofsubstrate temperature on the etching of silver films inductively coupled Cl2-based plasmas
S.D.Park, Y.J.Lee, S.G.Kim,H.H.Choe, M.P.Hong, G.Y.Yeom
Surface and Coatings Techonology, 171 (2003) 285-289
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4. Characteristics of Ag etching using inductively coupled Cl2-based plasmas
Y.J. Lee, S.D. Park, B.K. Song, S.G. Kim, H.H. Choe, M.P. Hong and G.Y. Yeom
Jpn.J. Appl. Phys, 42 (2003) 286-290
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5. The study of atmospheric pressure plasma for surface cleaning
C.H. Yi, Y.H. Lee, and G.Y. Yeom
Surface and Coatings Technology, 171 (2003) 237-240
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6. Effects of additive gases on Ag etching using inductively coupled Cl2-based plasmas

S.D. Park, Y.J. Lee G.Y. Yeom, S.G. Kim, H.H. Choe and M.P. Hong
Journal of the Korean Physical Society, 42 (2003) S804-S808
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7. Internal linear inductively coupled plasma (ICP) sources for large area FPD etch process applications
Y.J. Lee, K.N. Kim, B.K. Song, and G.Y. Yeom
Materials Science in Semiconductor Processing 5, (2003) 419-423
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8. Effects of an atmospheric pressure plasma cleaning on the outgassing characteristics of MgO layer fo plasma display panel
B.K. Song, Y.J. Lee, C.H. YI, H.K. Hwang and G.Y. Yeom
Jpn. J. Appl. Phys, 42 (2003) L74-L76
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9. High rate sapphire etching using BCl3-based inductively coupled plasma

D.W. Kim, C.H. Jeong, K.N. Kim, H.Y. Lee, H.S. Kim and G.Y. Yeom, and Y.J. Sung
Journal of the Korean Physical Society, 42, (2003) S795-S799
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10.Effect of N-based gases to C3F8/O2 on global warming during silicon nitride PECVD chamber cleaning using a remote plasma source
J.H. Kim, C.H. Oh, N.E. Lee, and G.Y. Yeom
Journal of the Korean Physical Society, 42 (2003) S800-S803
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11. A study of GaN etching characteristics using HBr-based inductively coupled plasmas

D.W.Kim, C.H.Jeong, H.Y.Lee, H.S.Kim, Y.J.Sung, and G.Y.Yeom
Solid-State Electronics, 47 (2003) 549-552
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12. Characteristic of a dielectric barrier discharges using capillary dielectric and its application to photoresist etching

C.H. Yi, Y.H. Lee, D.W. Kim, and G.Y. Yeom
Surface and Coatings Technology, 163-164 (2003) 723-727
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13. Etch damage evaluation of low-angle, forward-reflected neutral beam etching

D.H. Lee, M.J. Chung, H.K. Hwang, and G.Y. Yeom
Materials Science and Engineering, C23 (2003) 221-224
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14. High-rate dry etching of ZnO in BCl3/CH4/H2 plasmas
J.W. Bae, C.H. Jeong, H.K. Kim, K.K. Kim, N.G. Cho, T.Y. Seong, S.J. Park, Ilesanmi ADESIDA and G.Y. YEOM
Jpn. J. Appl. Phys, 42 (2003) L535-L537
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15. Increase of cleaning rate and reduction in global warming effect during C4F8O/O2 remote plasma cleaning of silicon nitride by adding NO and N2O
C.H. Oh, N.E. Lee, J.H. Kim, G.Y. Yeom, S.S. Yoon, and T.K. Kwon
Thin Solid Films, 435 (2003) 264-269
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16. Linear internal inductively coupled plasma (ICP) Source with magnetic fields for large area processing

Y.J. Lee, K.N. Nam, B.K. Song, and G.Y. Yeom
Thin Solid Films, 435 (2003) 275-279
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17. High rate saphire (Al2O3) etching in inductively coupled plasmas using axial external magnetic field

D.W. Kim, C.H. Jeong, K.N. Kim, H.Y. Lee, H.S. Kim, Y.J. Sung, and G.Y. Yeom
Thin Solid Films, 435 (2003) 242-246
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18. Effect of N-containing additive gases on global warming gas emission during remote plasma cleaning process of silicon nitride PECVD chamber using C4F8/O2/Ar chemistry

C.H. Oh, N.E. Lee, J.H. Kim, G.Y. Yeom, S.S. Yoon, and T.K. Kwon
Surface and Coatings Technology, 171 (2003) 267-272
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19. The etching mechanism of (Zr0.8Sn0.2)TiO4(ZST) film by using Cl2/O2-gas plasma

K.H. Kwon, A.M. EFREMOV, G.Y. Yeom, and Y.I. Kang
Journal of the Korean Physical Society, 42 (2003) S809-S813
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20. Etch characteristics of silver by inductively coupled fluorine-based plasmas
S.D. Park, Y.J. Lee, S.G. Kim, H.H. Choe, M.P. Hong, and G.Y. Yeom
Thin Solid Films 445, (2003) 138-143
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21. Room temperature GaN vertical cavity surface emitting laser operation in an extended cavity scheme
S.H. Park, J.H. Kim, H.S. Jeon, Tan. Sakong, S.N. Lee, S.H. Chae, Y. Park, C.H. Jeong, G.Y. Yeom,
and T.H. Cho
APPLIED PHYSICS LETERS, E 83 (2003) 11
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International Publications 2002    

1. Dry etching of sapphire subsrtate for device separation in chlorine-based inductively coupled plasmas
C.H. Jeong, D.W. Kim, J.W. Bae, Y.J. Sung, J.S. Kwak, Y.J. Park, and G.Y.
Materials Science & Engineering, B B93(1-3) (2002) 60-63
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2. Particle-in-cell simulation of a neutral beam source for materials processing
M.S. Hur, S.J. Kim, H.S. Lee, J.K. Lee, and G.Y. Yeom
IEEE Transactions on Plasma Science, 30(1,Pt.1) (2002) 110-111
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3. Surface properties of GaN fabricated by laser lift-off and ICP etching
H.S. Kim, Martin D. Dawson, and G.Y. Yeom
Journal of the Korean Physical Society, 40(4) (2002) 567-571
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4. A study of sapphire etching characteristics using BCl3-based inductively coupled plasmas

C.H. Jeong, D.W. Kim, K.N. Kim, and G.Y. Yeom
Japanese Journal of Applied Physics Part1, 41(10) (2002) 6206-6208
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5.C4F8O/O2 N-based additive gases for silicon nitrid PECVD chamber cleaning with low global warming potential
J.H. Kim, J.W. Bae, C.H. Oh, K.J. Kim, N.E. Lee, and G.Y. Yeom
Japanese Journal of Applied Physics, Part 1 41 (2002) 6570-6573
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6. Study on the low angle forward reflected neutral beam etching system for SiO2 etching
M.J.Chung, D.H.Lee, and G.Y.Yeom
Thin Solid Films, 420-421 (2002) 579-583
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7. Characteristics of a dielectric barrier discharges using capillary dielectric and its application to surface cleaning

C.H. Yi, Y.H. Lee, D.W. Kim, and G.Y. Yeom
Surface and Coatings Technology, 163-164 (2002) 723-727
PDF file

8. Effects of Tin concentration on the electrical properties of room-temperature ion-beam-assisted-evaporation-deposited indium oxide thin films
J.W.. Bae, S.D. Park, N.G. Cho, D.H.. Lee, and G.Y. Yeom
Japanese Journal of Applied Physics Letter, Part 2 41 (2002) L999-L1001
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9. Effect of N2O to C4F8/O2 on global warming during silicon nitride PECVD chamber cleaning using a remote inductively coupled plasma source

J.H. Kim, C.H. Oh, N.E. Lee, and G.Y. Yeom
Japanese Journal of Applied Physics Letter, Part 2 41 (2002) L1495-L1498
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10. Damage during SiO2 etching by low-angle forward reflected neutral beam

D.H. Lee, M.J. Chung,, S.D. Park, and G.Y. Yeom
Japanese Journal of Applied Physics Letter, Part 2 41 (2002) L1412-L1415
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11. Effect of microstructures on the coercivity of Fe1-xBx(0¡Âx¡Â0.2) films prepared by dc magnetron sputtering

H.S. Shin, J.W. Hong, T.S. Jang, E.P. Yoon, I.S. Kim, G.Y. Yeom, and J.W. Park
Vacuum, 67 (2002) 185-189
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International Publications 2001    
1. Development of a low angle forward reflected neutral oxygen beam for materials processing
D.H Lee, J.W. Bae, S.D. Park, and G.Y. Yeom
Thin Solid Films, 398-399 (2001) 647-651
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2. A study of transparent indium tin oxide(ITO) contact to p-GaN

D.W. Kim, Y.J. Sung, J.W Park, and G.Y. Yeom
Thin Solid Films, 398-399 (2001) 87-92
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3. Effect of O2(CO2)/C4F8O gas combinations on global warming gas emission in silicon nitride PECVD plasma cleaning
B.H. Oh, J.W. Bae, J.H. Kim, K.J. Kim, Y.S. Ahn, N.E. Lee, G.Y. Yeom, S.S. Yoon, S.K. Chae, M.S. Ku,
S.G. Lee, and D.H. Cho
Surface and Coatings Technology, 146-147 (2001) 522-527
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4. Investigation of the outgassing characteristics of the materials comprising a plasma display panel
H.R. Han, Y.J. Lee, and G.Y. Yeom
Journal of Vacuum Science & Technology A, 19(4,Pt.1) (2001) 1099-1104
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5. Indium-tin-oxide thin film deposited by a dual ion beam assisted e-beam evaporation system
J.W. Bae, J.S. Kim, and G.Y. Yeom
Nuclear instruments & Methods in Physics Research,Section B 178 (2001) 311-314
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6. Etch end-point detection of GaN-based devices using optical emission spectroscopy
H.S. Kim, Y.J. Sung, D.W. Kim, T. Kim, Dawson, M.D. and G.Y. Yeom
Materials Science & Engineering, B, B82(1-3) (2001) 159-162
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7. High rate etching of sapphire wafer using Cl2/BCl3/Ar inductively coupled plasmas

Y.J. Sung, H.S. Kim, Y.H. Lee, J.W. Lee, S.H. Chae, Y.J. Park, and G.Y. Yeom
Materials Science & Engineering, B, B82(1-3) (2001) 50-52
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8. Dry etching characteristics of ITO thin films deposited on plastic substrates

Y.J. Lee, J.W. Bae, H.R.Han, Kim,J.S Han, and G.Y. Yeom
Thin Solid Films, 383(1,2) (2001) 281-283
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9. The effects of surface terminal bonds and microstructure of SiO2 aerogel films on dry etching
S.J. Wang, H.H. Park, G.Y. Yeom, and S.H. Hyun
Applied Surface Science, 169-170 (2001) 457-462
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10. Etch characteristics of SrBi2Ta2O9(SBT) thin films using magnetized inductively coupled plasmas

Y.J. Lee, C.H. Jeong, J.W. Bae, I.K. You, J.W. Park, and G.Y. Yeom
Thin Solid Films, 398-399 (2001) 652-656
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11. Characteristics of He/O2 atmospheric pressure glow discharge and its dry etching properties of organic materials
Y.H. Lee, C.H. Yi, M.J. Chung, and G.Y. Yeom
Surface and Coatings Technology, 146-147 (2001) 474-479
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12. Refractive sapphire microlenses fabricated by chlorine-based inductively coupled plasma etching

S.H. Park, H.S. Jeon, Y.J. Sung, and G.Y. Yeom
Applied Optics, 40(22) (2001) 3698-3702
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13. Characterization of an oxygen plasma by using a Langmuir probe in an inductively coupled plasma

J.D. Kim, G.H. Kim,T.H. Chung, G.Y. Yeom, and K.H. Kwon
Journal of the Korean Physical Society, 38(3) (2001) 259-263
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International Publications 2000    
1. A study of lead zirconate titanate etching characteristics using magnetized inductively coupled plasmas
Y.J. Lee, H.R. Han, J. Lee, and G.Y. Yeom
Surface and Coatings Technology, 131(1-3) (2000) 257-260
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2. Etching characteristics of lead magnesium niobate-lead titanate(PMN-PT) relaxor ferroelectrics
J.W. Jang, Y.H. Lee, Y.J. Lee, J. Lee, and G.Y. Yeom
Surface and coatings Technology, 131(1-3) (2000) 252-256
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3. A study on the etch characteristics of ITO thin film using inductively coupled plasmas
J.Y. Park, H.S. Kim, D.H. Lee, K.H. Kwon, and G.Y. Yeom
Surface and Coatings Technology, 131(1-3) (2000) 247-251
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4. Properties of amorphous tin-doped indium oxide thin films deposited by O2/Ar mixture ion beam-assisted system at room temperature
H.J. Kim, J.W. Bae, J.S. Kim, K.S. Kim, Y.C. Jang, G.Y. Yeom, and N.E. Lee
Surface and Coatings Technology, 131(1-3) (2000) 201-205
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5. Tin-doped indium oxide thin film deposited on organic substrate using oxygen ion beam assisted deposition
J.W. Bae,H.J. Kim, J.S. Kim. Y.H. Lee, N.E. Lee, G.Y. Yeom, and Y.W. Ko
Surface and Coatings Technology, 131(1-3) (2000) 196-200
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6. Electrical, optical, and structural characteristics of ITO thin films by krypton and oxygen dual ion-beam assisted evaporation at room temperature
H.J. Kim, J.W. Bae, J.S. Kim, K.S. Kim, Y.C. Jang, G.Y. Yeom, and N.E. Lee
Thin Solid Films, 377-378 (2000) 115-121
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7. Effects of oxygen radical on the properties of indium tin oxide thin films deposited at room temperature by oxygen ion beam assisted evaporation
J.S. Kim, J.W. Bae, H.J. Kim, N.E.Lee, G.Y. Yeom, and K.H.Oh
Thin Solid Films, 377-378 (2000) 103-108
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8. Characteristics of magnetized inductively coupled plasma source for flat panel display applications

Y.J. Lee, H.R. Han, and G.Y. Yeom
Surface and Coatings Technology, 133-134 (2000) 612-616
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9. Dry etch characteristics of Al-Nd films for TFT-LCD

H.R. Han, Y.J. Lee, G.Y. Yeom, K.H. Oh, and M.P. Hong
Surface and Coatings Technology, 133-134 (2000) 606-611
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10. Magnetized inductively coupled plasma etching of GaN in Cl2/BCl3 plasmas

Y.H. Lee, Y.J. Sung, G.Y. Yeom, J.W. Lee, and T.I. Kim
Journal of Vacuum Science & Technology,A, 18(4, Pt.1) (2000) 1390-1394
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11. Characterization of yttria-stabilized zirconia thin films prepared by radio frequency magnetron sputtering for a combustion control oxygen sensor

J.W. Bae, J.Y. Park S.W. Hwang, G.Y. Yeom, K.D. Kim,Y.A. Cho, J.S. Jeon, and D. Choi
Journal of the Electrochemical Society, 147(6) (2000) 2380-2384
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12. Effects of oxygen ion beam plasma conditions on the properties of indium tin oxide thin films
J.W. Bae, H.J. Kim,Kim, J.S. Kim, N.E. Lee, and G.Y. Yeom
Vacuum, 56(1) (2000) 77-81
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13. Effects of plasma conditions on the etch properties of AlGaN

H.S. Kim, D.H. Lee, J.W. Lee, T.I. Kim, and G.Y. Yeom
Vacuum, 56(1) (2000) 45-49
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14. Effects of H2 addition in magnetized inductively coupled C2F6 plasma etching of silica aerogel film

S.J. Wang, H.H. Park, and G.Y. Yeom
Japanese Journal of Applied Physics, Part 1 39(12B) (2000) 7007-7010
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15. Erratum:¡±Effects of BCl3 addition on Ar/Cl2 gas in inductively coupled plasmas for lead zirconate titanate etching¡±

T. H. An, J.Y. Park, G.Y. Yeom, E.G. Chang, and C.I. Kim
[J.Vac. Sci. Technol. A18, 1373(2000)]. J.Vac.Sci. Technol.,A, 18(6) (2000) 3012-3013
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16. Etching mechanism of (Ba.Sr)TiO3 films in high density Cl2/BCl3/Ar plasma
S.B. Kim, Y.H. Lee, T.H. Kim, G.Y. Yeom, and C.I. Kim
Journal of Vacuum Science & Technology, A, 18(4, Pt.1) (2000) 1381-1384
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17. Roles of N2 gas in etching of platinum by inductively coupled Ar/Cl2/N2 plasmas
J.H. Ryu, N.H. Kim, H.S. Kim, G.Y. Yeom, E.G. Chang, and C.I. Kim
Journal of Vacuum Science & Technology, A, 18(4, Pt.1) (2000) 1377-1380
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18. Effects of BCl3 addition on Ar/Cl2 gas in inductively coupled plasmas for lead zirconate titanate etchingEffects of BCl3 addition on Ar/Cl2 gas in inductively coupled plasmas for lead zirconate titanate etching
T.H. An, J.Y. Park, G.Y. Yeom, E.G. Chang, and C.I. Kim
Journal of Vacuum Science & Technology, A 18(4, Pt.1) (2000)
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19. Etching characteristics of SrBi2Ta2O9 film with Ar/CHF3 plasma
J.W. Seo, D.H. Lee, W.J. Lee, B.G. Yu, K.H. Kwon, G.Y. Yeom, E.G. Chang, and C.I. Kim
Journal of Vacuum Science & Technology, A18(4, Pt.1) (2000)
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20. Etch characteristics of platinum using Cl2/Ar/O2 gas mixtures
K.K. Kwon, S.Y. Kang, G.Y. Yeom, N.K. Hong, J.H. Lee
Journal of the Electrochemical Society, 147(5) (2000) 1807-1809
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International Publications 1999    

1. Characteristics of inductively coupled Cl2/BCl3 plasmas during GaN etching
H.S. Kim, G.Y. Yeom, J.W. Lee, and T.I. Kim
Journal of Vacuum Science & Technology, A 17(4, Pt.2) (1999) 2214-2219
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2. Etching characteristics of optical waveguides using inductively coupled plasmas with multidipole magnets
K.J. An, D.H. Lee, J.B. Yoo, J. Lee, and G.Y. Yeom
Journal of Vacuum Science & Technology, A 17(4, Pt.1) (1999) 1483-1487
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3. Facet formation of a GaN-based device using chemically assisted ion-beam etching with a photoresist mask
W.J. Lee, H.S. Kim, G.Y. Yeom, J.W. Lee, and T.I. Kim
Journal of Vacuum Science & Technology, A 17(4, Pt.1) (1999) 1230-1234
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4. Effects of variously configured magnets on the characteristics of inductively coupled plasmas

S.W. Hwang, Y.J. Lee, H.R. Han, J.B. Yoo, and G.Y. Yeom
Journal of Vacuum Science & Technology, A 17(4, Pt.1) (1999) 1211-1216
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5. A study on the characteristics of inductively coupled plasma using multidipole magnets and its application to oxide etching

K.J. An, H.S. Kim, J.B. Yoo, and G.Y. Yeom
Thin Solid Films, 341(1,2) (1999) 176-179
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6. Effects of CdS substrates on the physical properties of polycrystalline CdTe films
Y.H. Lee, W.J. Lee, Y.S. Kwon, G.Y. Yeom, and J.K. Yoon
Thin Solid Films, 341(1,2) (1999) 172-175
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7. Etch-induced damage in single crystal Si trench etching by planar inductively coupled Cl2/N2 and Cl2/HBr plasmas
Y.J. Lee, S.W. Hwang, G.Y. Yeom, J.W. Lee, and J.Y. Lee
Thin Solid Films, 341(1,2) (1999) 168-171
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8. Low-voltage characteristics of MgO-CaO films as a protective layer for AC plasma display panels by e-beam evaporation

J.H. Cho,R.W. Kim,K.E. Lee,C.Y. Son,G.Y. Yeom,H.J.Kim,;Kim,Jung-Yeul;Park,Jong-Wan
Journal of Materials Science, 34(20) (1999) 5055-5059
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9. Effects of etch-induced damage and contamination on the physical and electrical properties of cobalt silicides
H.S. Kim, J.K. Yoon, Y.H. Lee, Y.W. Ko, J.W. Park, and G.Y. Yeom
Japanese Journal of Applied Physics, Part 1, 38(10) (1999) 5788-5791
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10. Effect of CaO addition on the firing voltage of MgO films in AC plasma display panels

J.H. Cho, R.H. Kim, K.W. Lee, G.Y. Yeom, J.Y. Kim, and J.W. Park
Thin Solid Films, 350(1,2) (1999) 173-177
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11. Study on surface reaction of (Ba,Sr)TiO3 thin films by high density plasma etching

S.B. Kim, C.I. Kim, E.G. Chang, and G.Y. Yeom
Journal of Vacuum Science & Technology, A 17(4,Pt.2) (1999) 2156-2161
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12. Tin oxide films deposited by ozone-assisted thermal chemical vapor deposition

J.W. Bae, S.W. Lee, K.H. Song, J.I. Park, K.J. Park, Y.W. Ko, and G.Y. Yeom
Japanese Journal of Applied Physics, Part1 38(5A) (1999) 2917-2920
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13. Etch-induced physical damage and contamination during highly selective oxide etching using C4F8/H2 helicon
H.S. Kim, W.J. Lee, G.Y. Yeom, J.H. Kim, and K.W. Whang
Journal of the Electrochemical Society, 146(4) (1999) 1517-1522
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14. Investigation of surface polymerization on silicon exposed to C4F8 helicon wave plasmas

W.J. Lee, H.S. Kim,G.Y. Yeom, and J.T.Baek
Thin Solid Films, 341(1,2) (1999) 184-187
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15. A study of GaN etch mechanisms using inductively coupled Cl2/Ar plasmas
H.S. Kim, G.Y. Yeom, A.W. Lee, and T.I. Kim
Thin Solid Films, 341(1,2) (1999) 180-183
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16. Thermal stability enhancement of Cu/WN/SiOF/Si multilayers by post-plasma treatment of fluorine-doped silicon dioxide
S.H. Lee, D.J. Kim, S.H. Yang, J.W. Park, S.I. Sohn, K.H. Oh, Y.T. Kim, J.Y. Kim, G.Y. Yeom, and J.W. Park
Journal of Applied Physics, 85(1) (1999) 473-477
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International Publications 1998    


1. Etch characteristics of GaN using inductively coupled Cl2/Ar and Cl2/BCl3 plasmas

Y.H. Lee, H.S. Kim, G.Y. Yeom, J.W. Lee, M.C. Yoo, and T.I. Kim
Journal of Vacuum Science & Technology, A, 16(3,Pt.2), 1478-1482
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2. Etch properties of gallium nitride using chemically assisted ion beam etching(CAIBE)
W.J. Lee, H.S. Kim, J.W. Lee, T.I. Kim, and G.Y. Yeom
Japanese Journal of Applied Physics, Part 1, 37(12B) (1998) 7006-7009
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3. Effects of post annealing and oxidation processes on the removal of damage generated during the shallow trench etch process
Y.J. Lee,S.W. Hwang,K.H. Oho,J.Y. Lee, and G.Y. Yeom
Japanese Journal of Applied Physics, Part 1 37(12B) (1998) 6916-6921
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4. A preliminary study on the etching behavior of SiO2 aerogel film with CHF3 gas
S.J. Wang,H.H. Park, and G.Y. Yeom
Journal of the Korean Physical Society, 33 (1998) S135-S137
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5. Effect of O2 plasma treatment on the properties of SiO2 aerogel film
H.R. Kim, H.H. Park,S.H.Hyun,G.Y. Yeom
Thin Solid Films, 332(1-2) (1998) 444-448
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6.
Etching properties of Pt thin films by inductively coupled plasma.
K.H. Kwon,I. Chang, S.J. Yun,and G.Y. Yeom
Journal of Vacuum Science & Technology, A(1695) (1998) 2772-2776
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International Publications 1997    

1. Effects of inductively coupled plasma conditions on the etch properties of GaN and ohmic contact formations
H.S. Kim, Y.H. Lee, G.Y. Yeom, J.W. Lee,and T.I. Kim
Materials Science & Engineering, B50(1-3) (1997) 82-87
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2. Physical damage and contamination by magnetized inductively coupled plasmas and effects of various cleaning and annealing methods
W.J. Nam, G.Y. Yeom. J.H. Kim, K.W. Whang, and J.K. Yoon
Journal of Vacuum Science & Technology, 15(3,Pt.1) (1997) 590-595
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3. Study of shallow silicon trench etch process using planar inductively coupled plasmas

J.H. Lee, G.Y.Yeom, J.W. Lee
Journal of Vacuum Science & Technology, A15(3) (1997) 573-578
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International Publications 1996    
1. Study of radiation damage and contamination by magnetized inductively coupled plasma etching
H.S. Kim, W.J. Nam, G.Y. Yeom, H.J. Lee, J.H. Kim, and K.W. Whang
Journal of Vacuum Science & Technology, A 14(3, Pt.1) (1996) 1026-1066
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International Publications 1990
1. Si/SiO2 Etch properties using CF4 and CHF3 in RF Cylindrical Magnetron Discharges
G.Y. Yeom, and Mark J. Kushner
Appl. Phys. Lett. 56(9) 26 February (1990)
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International Publications 1989

1. Cylindrical magnetron discharges. ¥°. Current-Voltage Characteristics for dc- and rf- driven discharge sources
G.Y. Yeom, Mark J. Kushner, and John A. Thornton
J. Appl. Phys. 65(10), 15 May (1989)
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2. Study of radiation damage and contamination by magnetized inductively coupled plasma etching
G.Y. Yeom, Mark J. Kushner, and John A. Thornton
J. Appl. Phys. 65(10), 15 May (1989)
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3. Magnetic field effects on Cylindrical Magnetron Reactive Ion Etching of Si/SiO2 IN CF4 and CF4/H2 Plasmas
G.Y. Yeom, Mark J. Kushner, and John A. Thornton
J. Vac. Sci. Technol., A7(3), May/Jun (1989)
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International Publications 1988

1. Magnetic field desogns for cylindrical-pist magnetrin discharge sources
G.Y. Yeom, Alan S. Penfold, and John A. Thornton
J. Vac. Sci. Technol., A6(6), (1988)
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